| 发明名称 |
UNDERFILL CURING METHOD USING CARRIER |
| 摘要 |
A method includes bonding a carrier over a top die. The method further includes curing an underfill disposed between a substrate and the top die. The method further includes applying a force over the carrier during the curing. The method further includes removing the carrier from the top die. |
| 申请公布号 |
US2013244378(A1) |
申请公布日期 |
2013.09.19 |
| 申请号 |
US201213418868 |
申请日期 |
2012.03.13 |
| 申请人 |
KAO CHIN-FU;LIN JING-CHENG;HUNG JUI-PIN;LU SZU WEI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
KAO CHIN-FU;LIN JING-CHENG;HUNG JUI-PIN;LU SZU WEI |
| 分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
