| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which suppresses peeling in a multilayer wiring layer, and has high reliability.SOLUTION: An electronic device includes a wiring board 70, a semiconductor device 72 mounted on the wiring board 70, and a solder terminal 20 which connects the wiring board 70 with the semiconductor device 72. The semiconductor device 72 includes a multilayer wiring layer 32, an electrode pad 40 provided on the multilayer wiring layer 32, a protection film 38 which is provided on the multilayer wiring layer 32 and has an opening on the electrode pad 40, and a connection terminal 10 which is provided on the electrode pad 40 and the protection film 38 and is connected to the wiring board 70 through the solder terminal 20. In the connection terminal 10, a cross-sectional area in a first cross section parallel to the surface of the protection film 38 is larger than that in a second cross section positioned on the same plane as the surface of the protection film 38, in an end in contact with the solder terminal 20, and the solder terminal 20 has a small area portion 22 having a cross-sectional area smaller than that in the first cross section. |
