METHOD OF MANUFACTURING ULTRASOUND TRANSDUCER FOR USE IN ULTRASOUND IMAGING DEVICE, AND ULTRASOUND TRANSDUCER AND ULTRASOUND PROBE MANUFACTURED ACCORDING TO THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide an improved method of manufacturing an ultrasonic transducer which has a limited dimension without decreasing imaging resolution.SOLUTION: A step for providing a carrier of semiconductor material having a two-dimensional array of a conductive pads and an electric circuit connected to the conductive pads for further processing an ultrasound transducer outside is included. Next, a layer including piezo electrical material is provided on the carrier, and it covers the two-dimensional array of the conductive pads. Each of a plurality of transducer elements is separated by dicing the two-dimensional array on the carrier. Finally, a grounding layer is provided on the plurality of transducer elements for grounding the respective transducer elements. Here, a buffer layer is provided between the carrier and the layer including the piezo electrical material. The buffer layer has a thickness appropriate for dicing each of the plurality of transducer elements on the carrier.