| 摘要 |
PROBLEM TO BE SOLVED: To provide: a curable resin composition in which a dielectric constant and a dielectric loss tangent of an obtained cured product are low, and that is excellent in heat resistance; a cured product of the composition; and a printed wiring board.SOLUTION: A curable resin composition includes: an epoxy resin (A1) that is a naphthol novolak type epoxy resin (A), and that contains a trimer (x1) shown by structural formula (1) in the epoxy resin (in the formula Rand Reach independently denote a hydrogen atom, a 1-4C alkyl group or a 1-4C alkoxy group; and Gr denotes a glycidyl group); and a polyphenylene ether resin (B), a cured product comprises the composition, and a printed wiring board uses the composition. |
