| 摘要 |
PROBLEM TO BE SOLVED: To suppress positional deviations between power modules and coolers and a pressure loss of cooling water, when the plurality of power modules and the plurality of coolers are alternately laminated.SOLUTION: On a surface 26 of a semiconductor element module 20, projecting portions 28a and 28b are formed separated from positions opposite to projecting portions 24a-24d on a surface 22. In a cooler 30 in which the semiconductor element modules 20 are disposed on both surfaces 32 and 36, recessed portions 34a-34d on the surface 32 and recessed portions 38a and 38b on the surface 36 are separately formed so as not to oppose to each other. In such a power module device 10, when the plurality of semiconductor element modules 20 and the plurality of coolers 30 are alternately laminated, the projecting portions 24a-24d on the surfaces 22 of the semiconductor element modules 20 are fitted with the recessed portions 34a-34d of the coolers 30 adjacent on the surface 22 sides, and the projecting portions 28a and 28b on the surfaces 26 of the semiconductor element modules 20 are fitted with the recessed portions 38a and 38b of the coolers 30. |
