发明名称 SOLDER POWDER AND METHOD OF PRODUCING SOLDER POWDER
摘要 A solder powder having an average particle diameter of, for example, 0.05 mum or more and less than 3 mum is obtained by a method of producing a solder powder, including the steps of: putting solid or liquid metal, a non-aqueous solvent, and crushing balls having a diameter of 0.05 mm to 5 mm into a container to obtain a mixture; heating the mixture to 150° C. or higher and stirring the mixture; separating the crushing balls from the mixture after the stirring to obtain a mixture of the solder powder and the non-aqueous solvent; and performing solid-liquid separation on the mixture of the solder powder and the non-aqueous solvent to obtain a solder powder.
申请公布号 US2013244034(A1) 申请公布日期 2013.09.19
申请号 US201013885505 申请日期 2010.11.18
申请人 ISHIKAWA YUICHI;DOWA HOLDINGS CO., LTD. 发明人 ISHIKAWA YUICHI
分类号 B23K35/02 主分类号 B23K35/02
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