| 摘要 |
The present technology pertains to a semiconductor device, semiconductor-device manufacturing method, semiconductor wafer, and electronic apparatus that make it possible to provide a miniaturizable semiconductor device. Said semiconductor device is provided with a semiconductor substrate, a wiring layer formed on top of said semiconductor substrate, and a drive circuit provided in a circuit-formation region of the semiconductor substrate. The semiconductor device (110) is also provided with the following: a pad electrode (103) that is electrically connected to the drive circuit and exposed at the side of the wiring layer; and an external-connection terminal (108) that is provided on the side of the semiconductor substrate and wiring layer and is electrically connected to the pad electrode (103). |
