MULTI-LAYER LAMINATED FILM

摘要

The present invention addresses the problem of providing a multi-layer laminated film being capable of yielding a pressure -thermoformed product which comprises the multi-layer laminated film and an intermediate film and a support that are displaced on at least one surface of the multi-layer laminated film and in which the wavy strain due to pressure-thermoforming is minimized. This multi-layer laminated film is characterized by: being produced by laminating layers (A) of a thermoplastic resin (A) and layers (B) of a thermoplastic resin (B) alternately with a total number of the layers (A) and (B) of 51 or more; exhibiting heat shrinkage stresses of 0.5 to 5MPa at 150°C respectively in the lengthwise and widthwise directions; and exhibiting a kick-off temperature of heat shrinkage stress of 110°C or lower in the lengthwise and/or widthwise direction. The kick-off temperature of heat shrinkage stress is defined, in the heat shrinkage stress curve determined under the conditions of 25 to 200°C and a temperature rise rate of 5°C/min, as the temperature at the intersection where the base line before the rising of the heat shrinkage stress curve crosses the tangent at the point at which the inclination of the heat-shrinkage stress curve reaches the maximum after the rising thereof.