发明名称 |
METHOD FOR METALLIZATION OR METALLIZATION AND INTERCONNECTION OF BACK CONTACT SOLAR CELLS |
摘要 |
The present invention relates to cost effective methods for metallisation and or metallisation and interconnection of high efficiency silicon based back-contacted back-junction solar panels and solar panels thereof having a multiplicity of alternating rectangular emitter- and base regions on the back-side of each cell, each with rectangular metallic electric finger conductor above and running in parallel with the corresponding emitter- and base region, a first insulation layer in-between the wafer and finger conductors, and a second insulation layer in between the finger conductors and cell interconnections. |
申请公布号 |
US2013240023(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
US201213631595 |
申请日期 |
2012.09.28 |
申请人 |
RENEWABLE ENERGY CORPORATION ASA |
发明人 |
SEWELL RICHARD HAMILTON;LYON ALAN FRANCIS;BENTZEN ANDREAS |
分类号 |
H01L31/05;H01L31/0224;H01L31/048;H01L31/20 |
主分类号 |
H01L31/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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