HIGH CAPACITANCE DENSITY METAL-INSULATOR-METAL CAPACITORS

摘要

This disclosure provides systems, methods and apparatus comprising high capacitance density metal-insulator-metal capacitors. In one aspect, an apparatus includes a first base metal layer (1004) on a first side of a substrate (1002). A first polymer layer (1012) is disposed on the first base metal layer and on the first side of the substrate. The first polymer layer defines a first plurality of vias (1014) though the first polymer layer, the first plurality of vias exposing portions of the first base metal layer. A first electrode layer (1016) is disposed on the first polymer layer. The first electrode layer contacts the portions of the first base metal layer. A first dielectric layer (1020) is disposed on the first electrode layer. A second electrode layer (1024) is disposed on the first dielectric layer. The first dielectric layer electrically isolates the first electrode layer from the second electrode layer.