发明名称 ETCHING METHOD AND ETCHING DEVICE
摘要 PROBLEM TO BE SOLVED: To expand the range of material selection while enhancing productivity, in formation of a fine uneven pattern.SOLUTION: In the etching for forming a fine uneven pattern, a standing-wave Ls of light L is produced in a space above the processed surface of a substrate 4, and the processed surface is etched while supplying a mask material 20 consisting of atoms interacting with the standing-wave Ls to the processed surface through the standing-wave Ls.
申请公布号 JP2013187439(A) 申请公布日期 2013.09.19
申请号 JP20120052576 申请日期 2012.03.09
申请人 FUJIFILM CORP 发明人 OTSU AKIHIKO
分类号 H01L21/3065 主分类号 H01L21/3065
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