发明名称 PLASMA PROCESSING APPARATUS AND CONTROL METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent a dielectric window 4 from being cut with ions of plasma 8 by reducing the plasma potential, and to increase the plasma density by processing the plasma potential while suppressing occurrence of RF oscillation thereof.SOLUTION: The plasma processing apparatus generating plasma by receiving high frequency power supply includes a high frequency power supply which supplies high frequency power, a plasma potential detection unit which detects the potential of plasma and outputs a detection signal corresponding to the level of the potential, and a control unit which controls the high frequency power being supplied from the high frequency power supply in response to the detection signal output from the plasma potential detection unit.
申请公布号 JP2013187156(A) 申请公布日期 2013.09.19
申请号 JP20120053663 申请日期 2012.03.09
申请人 TOSHIBA CORP 发明人 SUZUKI HIROYUKI
分类号 H05H1/46;C23C14/34;H01L21/3065;H05H1/00 主分类号 H05H1/46
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