发明名称 HEAT FLOW CONTROL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a device which can be made compact and is simple, is capable of controlling a heat flow, and which can be applied to a heat switch or the like capable of performing control of the heat flow in a minute area.SOLUTION: A heat flow control device is configured by filling a part between opposing electrodes to which electric fields can be applied with an electrorheological fluid having heat conductive particles dispersed in a dispersion medium, and the electrorheological fluid is caused to function as a heat flow control layer by applying an electric field between the electrodes. Thus, a heat flow control device which can be made compact and is simple, and can perform heat flow control, is obtained.
申请公布号 JP2013185728(A) 申请公布日期 2013.09.19
申请号 JP20120049921 申请日期 2012.03.07
申请人 KRI INC 发明人 FUKUI TOSHIMI
分类号 F25B13/00 主分类号 F25B13/00
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