| 摘要 |
The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, which includes a base material layer having a glass transition temperature exceeding 180° C., and a pressure-sensitive adhesive layer having an elastic modulus at 180° C. of 1.0×105 Pa or more, which is formed on one side or both sides of the base material layer. The heat-resistant pressure-sensitive adhesive tape of the present invention can be used for temporarily fixing a chip in a production method of a substrateless semiconductor package which does not use a metal frame (for example, a production method of WLP).
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