| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate holding device capable of effectively cooling a processing object formed by laminating a silicon substrate on one surface of a glass substrate via an adhesive layer by electrostatic adsorption from a glass substrate side.SOLUTION: A substrate holding device EC of the present invention includes positive and negative electrodes 73a and 73b, a ceramic chuck body 71, and a resin rubber sheet 72 that is provided on an adsorption surface of a processing object S of the chuck body, and has an insulation property. The substrate holding device EC further includes cooling means 81 for cooling the chuck body, and heating means for heating the processing object S from a silicon substrate W side. |
