| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy powder for a bump, solder paste for a bump, and a solder bump suppressing generation of a needle-like projection.SOLUTION: A solder alloy powder for a bump has a component composition containing Ag: 2.8-4.2 wt.%, Cu: 0.4-0.6 wt.%, the balance being Sn and unavoidable impurities, and the unavoidable impurities include 8 ppm or less of Fe, 5 ppm or less of Ni, and 20 ppm or less of As. Also, a solder bump is formed using the solder alloy powder for a bump. |
