| 摘要 |
PROBLEM TO BE SOLVED: To provide an edge rinse apparatus and an edge rinse method which eliminate a function film formed at an outer peripheral part of a substrate without being limited by the outer shape of the substrate.SOLUTION: An edge rinse apparatus 1 eliminates a function film formed at outer peripheral parts 15a to 15d of a square type wafer 10 and includes: a rinse discharger 20 discharging a rinse liquid 23 to a photoresist film outer peripheral part 3a; a first blower 25 disposed at the inner side of the square type wafer 10 and blowing air from the inner side to the outer side; and a control device 40 causing the square type wafer 10 to move relative to the rinse discharger 20 and the first blower 25 so that the rinse discharger 20 and the first blower 25 move along the outer peripheral parts 15a to 15d of the square type wafer 10. |
