发明名称 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition that gives a resin film having high transparency and adhesiveness and excellent processability for an ITO electrode (processability when an ITO electrode is formed in a state of penetrating the resin film or formed on a surface of the resin film).SOLUTION: The negative photosensitive resin composition comprises: an epoxy group-containing acrylate resin (A) having an acid value of 30 to 100 mgKOH/g and a weight average molecular weight of 500 to 3,000; a polyfunctional acrylate compound (B) having four or more functional groups; a radical-generating photopolymerization initiator (C); an epoxy compound (D) having a weight average molecular weight of 200 to 550 and a glycidyl ether group; and a silane coupling agent (E) having an epoxy group.
申请公布号 JP2013186225(A) 申请公布日期 2013.09.19
申请号 JP20120050065 申请日期 2012.03.07
申请人 NIPPON ZEON CO LTD 发明人 TANABE AKIHIRO
分类号 G03F7/027;C08F290/00;C08G59/20;G03F7/004;G03F7/075 主分类号 G03F7/027
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