| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering target, in particular a sputtering target for FPD, which can suppress the occurrence of nodules and abnormal discharge even during continuous sputtering, and can provide a film in that there is no difference between the characteristics of a film formed on a substrate opposing to a clearance part and the characteristics of a film formed on the other part, that is, the uniformity of film characteristics is high.SOLUTION: A sputtering target is configured by arranging a plurality of split targets 2 on a backing plate 4 and joining the split targets 2 to the backing plate 4. The sputtering target is characterized in that a clearance part between the arranged split targets 2 is covered or filled with one material selected from a tape or sheet composed of an organic material or a pipe or rod-like material composed of an organic material. |
