THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

Disclosed is a printed circuit board. The printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a circuit pattern groove; a first circuit pattern filling the circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a circuit pattern groove at a top surface thereof; and a second pattern filling the circuit pattern groove of the second insulating layer, wherein the first insulating layer including a filler distributed in a resin material. Accordingly, the micro-buried pattern can be simply formed by removing the plating layer on the insulating layer through the chemical mechanical etching while forming the circuit pattern by filling the groove of the substrate through a plating scheme. In addition, the buried pattern can be formed while maintaining stiffness by the glass fiber of the core insulating layer by forming the buried pattern in the insulating layer after bonding the insulating layer formed of resin including the filler on the core insulating layer. As described above, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.