发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component and a method of manufacturing the same.SOLUTION: There is provided a multilayer ceramic electronic component, including: a ceramic body having a plurality of dielectric layers laminated therein; first and second internal electrodes having respective first and second capacitance portions and respective first and second lead-out portions, each of the first and second capacitance portions being formed on a surface of a corresponding one of the dielectric layers and separated from both side surfaces of the ceramic body, the first and second lead-out portions being separated from each other in a length direction of the dielectric layers and respectively extended from two side surfaces of the first and second capacitance portions to be exposed through the two side surfaces of the ceramic body; sealing parts enclosing two end portions and corner portions of the ceramic body; and first and second external electrodes enclosing the sealing parts and formed on the two end portions of the ceramic body to be electrically connected to the first and second lead-out portions, respectively.
申请公布号 JP2013187537(A) 申请公布日期 2013.09.19
申请号 JP20120269625 申请日期 2012.12.10
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE CHANG-UN;CHE JAE-YEOL;KIM DOO YOUNG;KIM WI HEON
分类号 H01G4/232;H01G4/12;H01G4/30 主分类号 H01G4/232
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