| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor wafer and an inspection method of the same, which can reduce a wafer measurement time without making a dicing line thick.SOLUTION: A semiconductor wafer comprises a plurality of semiconductor chips 3 divided by dicing lines 2. Each semiconductor chip 3 includes a plurality of terminals 4a, 4b, 4c having the same potential. The plurality of terminals 4a, 4b, 4c are connected by interconnection lines 5 through the dicing lines 2. The semiconductor wafer composes a pad 6a connected to the terminal 4a. The pad 6a is provided on the semiconductor chip 3 and does not exist on the dicing lines 2. |
