发明名称 |
MANUFACTURING METHOD FOR LAMINATED BOARD AND PRINTED WIRING BOARD |
摘要 |
<p>Provided is a laminated board that is provided with an insulating layer and copper foil positioned on at least one surface of the insulating layer, and that is used in a device mounting substrate obtained by forming a conductor circuit by etching the copper foil. The copper foil etching rate is between 0.68µm/min and 1.25µm/min under conditions where the laminated board it immersed in a sulfuric acid/hydrogen peroxide etching liquid comprising 55.9g/L of sulfuric acid and 19.6cc/L of 34.5% hydrogen peroxide and at a temperature of 30°C<u>+</u>1°C.</p> |
申请公布号 |
WO2013136729(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
WO2013JP01432 |
申请日期 |
2013.03.07 |
申请人 |
SUMITOMO BAKELITE CO., LTD.;NIPPON DENKAI, LTD. |
发明人 |
ITO, TEPPEI;OHIGASHI, NORIYUKI |
分类号 |
H05K3/06;C25D1/04;H05K1/09 |
主分类号 |
H05K3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|