| 摘要 |
PROBLEM TO BE SOLVED: To analyze a semiconductor chip without damaging the semiconductor chip to be analyzed.SOLUTION: First, a semiconductor device 10 and a second wiring board 210 are prepared (a preparation step). Then, an area that overlaps with first electrodes 170 in planar view is removed in a first sealing resin 140, so as to expose the first electrodes 170 with the first electrodes 170 and a semiconductor chip 100 connected with each other through first bonding wires 160 (a first electrode exposure step). Then, the semiconductor device 10 and the second wiring board 210 are arranged so as to make the first electrodes 170 and second electrodes 230 face in the same direction, and the first electrodes 170 and the second electrodes 230 are connected through second bonding wires 310 (a connection step). Then, an area that overlaps with the semiconductor chip 100 in planar view is removed in at least a first wiring board 110 from the side of a second surface opposite to a first surface, so as to form a first opening 130 and expose the semiconductor chip 100 (a semiconductor chip exposure step). |
