发明名称 LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LIGHT-EMITTING DEVICE
摘要 There are provided a light-emitting element mounting substrate having high bonding strength between a substrate main body and a metal portion, and a light-emitting device having high bonding strength between the substrate main body and the metal portion and high reliability. A light-emitting element mounting substrate includes a substrate main body (20) formed of a ceramic sintered body; and a silver-containing metal portion (2), a silver-containing region (4) existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion. Accordingly, it is possible to increase bonding strength between the substrate main body (20) and the metal portion (2).
申请公布号 US2013242565(A1) 申请公布日期 2013.09.19
申请号 US201113989570 申请日期 2011.11.25
申请人 ARAI TAKEYUKI;NAKASUGA MINORU;NAKAMOTO TETSUROU;KYOCERA CORPORATION 发明人 ARAI TAKEYUKI;NAKASUGA MINORU;NAKAMOTO TETSUROU
分类号 F21V21/00 主分类号 F21V21/00
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