发明名称 CURABLE RESIN COMPOSITION FOR SCREEN PRINTING, AND PRINTED WIRING BOARD WITH ELECTRICALLY INSULATED FILM FORMED FROM THE CURABLE RESIN COMPOSITION FOR SCREEN PRINTING
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition for screen printing hardly causing liquid drooping, having high affinity for inorganic materials, and formable of an electrically insulated film on a printed wiring board having a high-precision wiring pattern and having high adhesiveness to metal surface, using a screen printing method.SOLUTION: This curable resin composition for screen printing is characterized by comprising: (A) a cationically curable component including at least an epoxy compound; (B) an epoxidized polydiene resin; and (C) an isocyanuric acid skeleton-bearing compound, wherein the epoxy compound uses an epoxy compound having an aliphatic carbon ring and/or aromatic ring and glycidyl ether group.
申请公布号 JP2013184999(A) 申请公布日期 2013.09.19
申请号 JP20120049136 申请日期 2012.03.06
申请人 DAICEL CORP 发明人 OKAMOTO KAZUKI;MIZUSHIMA TAKAHIRO
分类号 C08G59/68;H05K3/28 主分类号 C08G59/68
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