发明名称 |
RF CALIBRATION THROUGH-CHIP INDUCTIVE COUPLING |
摘要 |
An integrated circuit includes a first chip and a second chip coupled to the first chip in a vertical stack. The first chip includes a radio frequency circuit and a first coil electrically coupled to the radio frequency circuit. The second chip includes a calibration circuit and a second coil electrically coupled to the calibration circuit. The calibration circuit is configured to calibrate the radio frequency circuit disposed on the first chip through inductive coupling between the first and second coils.
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申请公布号 |
US2013241634(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
US201213419911 |
申请日期 |
2012.03.14 |
申请人 |
HSIEH HSIEH-HUNG;LIU YI-HSUAN;YEH TZU-JIN;JOU CHEWN-PU;HSUEH FU-LUNG;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HSIEH HSIEH-HUNG;LIU YI-HSUAN;YEH TZU-JIN;JOU CHEWN-PU;HSUEH FU-LUNG |
分类号 |
H01L25/00 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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