发明名称 RF CALIBRATION THROUGH-CHIP INDUCTIVE COUPLING
摘要 An integrated circuit includes a first chip and a second chip coupled to the first chip in a vertical stack. The first chip includes a radio frequency circuit and a first coil electrically coupled to the radio frequency circuit. The second chip includes a calibration circuit and a second coil electrically coupled to the calibration circuit. The calibration circuit is configured to calibrate the radio frequency circuit disposed on the first chip through inductive coupling between the first and second coils.
申请公布号 US2013241634(A1) 申请公布日期 2013.09.19
申请号 US201213419911 申请日期 2012.03.14
申请人 HSIEH HSIEH-HUNG;LIU YI-HSUAN;YEH TZU-JIN;JOU CHEWN-PU;HSUEH FU-LUNG;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 HSIEH HSIEH-HUNG;LIU YI-HSUAN;YEH TZU-JIN;JOU CHEWN-PU;HSUEH FU-LUNG
分类号 H01L25/00 主分类号 H01L25/00
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