| 摘要 |
PROBLEM TO BE SOLVED: To provide a metalized film and a metal foil suitably used for manufacturing an extremely thin metal foil capable of making a fine pattern used for a buildup multilayer circuit board and a PDP electromagnetic wave shielding material or the like.SOLUTION: A peeling layer is formed on a film being a substrate, a metal layer is formed on the peeling layer by vacuum deposition or the like, and, thereby, a film with a metal foil that can be easily peeled from the film is formed. |
