| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element housing package which can easily inhibit spurious resonance.SOLUTION: A semiconductor element housing package comprises: a conductive substrate 21; a frame body 22 formed on the substrate 21 to form an element housing part 11 for housing a semiconductor element inside; and a lid fixing part 22d which is engraved such that a top face of a lid body 14 for sealing the element housing part 11 does not project from a top face of the frame body 22. |
