ETCHING AGENT FOR COPPER OR COPPER ALLOY

摘要

[Problem] The purpose of the present invention is to provide an etching agent for a process for etching copper or a copper alloy from an electronic substrate that includes both nickel, and copper or a copper alloy, wherein said etching agent foams little during use and can highly selectively etch copper or a copper alloy. [Solution] An etching agent used in a process for selectively etching copper or a copper alloy from an electronic substrate that includes both nickel, and copper or a copper alloy, said etching agent for copper or a copper alloy having as essential components: a chain-like alkanolamine (A); a chelating agent (B) having an acid group in the molecules thereof; and hydrogen peroxide (C).