| 摘要 |
<p>The purpose of the present invention is to provide a vacuum suction stage, which suppresses damages of a dicing tape when performing dicing, a semiconductor wafer dicing method using the vacuum suction stage, and a semiconductor wafer annealing method using the vacuum suction stage, which suppresses foaming of a grinding protection tape. This vacuum suction stage has a placing surface (1a) for placing a semiconductor wafer (6) thereon, and in the placing surface (1a), vacuum suction holes (2) are formed merely on the outer circumference of the chip region (6a) of the semiconductor wafer (6).</p> |
