| 摘要 |
PROBLEM TO BE SOLVED: To provide a hollow package molding mold capable of keeping airtightness even if a hollow package is formed by a plurality of resins, a hollow package, and a manufacturing method of the hollow package.SOLUTION: A hollow package molding mold includes an upper mold having a pin hole; a cap position adjusting pin inserted in the pin hole; a projection hole forming a projection molding space for molding a projection 5a; a first lower mold for molding a cap 5 having the projection 5a at a head portion by injecting resin into a cap molding space formed when clamped with the upper mold and the projection molding space; a second lower mold on which a substrate 3 is placed, and which is replaced with the first lower mold after molding the cap 5; and an intermediate mold inserted between the upper mold and the second lower mold. When the upper mold and the second lower mold are clamped through the intermediate mold, the cap position adjusting pin projects out the cap 5 to the substrate 3 side so as to place the cap 5 on the substrate 3, and resin is filled in a space between the cap 5 and the upper mold to cover the cap 5, thereby molding a mold 6 stuck to the cap 5 and the substrate 3. |
