发明名称 |
INTERCONNECT STRUCTURES AND METHODS OF MANUFACTURING OF INTERCONNECT STRUCTURES |
摘要 |
Interconnect structures and methods of manufacturing the same are disclosed herein. The method includes forming a barrier layer within a structure and forming an alloy metal on the barrier layer. The method further includes forming a pure metal on the alloy metal, and reflowing the pure metal such that the pure metal migrates to a bottom of the structure, while the alloy metal prevents exposure of the barrier layer. The method further includes completely filling in the structure with additional metal.
|
申请公布号 |
US2013244424(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
US201313886836 |
申请日期 |
2013.05.03 |
申请人 |
MACHINES CORPORATION INTERNATIONAL BUSINESS;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDELSTEIN DANIEL C.;NOGAMI TAKESHI |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|