发明名称 |
Wire Bonding Structures for Integrated Circuits |
摘要 |
A device includes a substrate, and a bond pad over the substrate. A protection layer is disposed over the bond pad. The protection layer and the bond pad include different materials. A bond ball is disposed onto the protection layer. A bond wire is joined to the bond ball.
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申请公布号 |
US2013241058(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
US201213422306 |
申请日期 |
2012.03.16 |
申请人 |
YU CHEN-HUA;LII MIRNG-JI;LEE CHIEN-HSIUN;CHEN YUNG CHING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU CHEN-HUA;LII MIRNG-JI;LEE CHIEN-HSIUN;CHEN YUNG CHING |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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