发明名称 |
SYSTEM AND METHOD FOR MODELING THROUGH SILICON VIA |
摘要 |
A computer implemented system comprises a processor programmed to analyze a circuit to determine a response of the circuit to an input radio frequency (RF) signal, for at least one of designing, manufacturing, and testing the circuit. An interposer model is tangibly embodied in a non-transitory machine readable storage medium to be accessed by the processor. The interposer model is processed by the computer to output data representing a response of a though substrate via (TSV) to the radio frequency (RF) signal. The interposer model comprises a plurality of TSV models. Each TSV model has a respective three-port network. One of the ports of each three-port network is a floating node. The floating nodes of each of the three-port networks are connected to each other.
|
申请公布号 |
US2013246990(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
US201213419959 |
申请日期 |
2012.03.14 |
申请人 |
YEN HSIAO-TSUNG;LIN YU-LING;KUO CHIN-WEI;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
YEN HSIAO-TSUNG;LIN YU-LING;KUO CHIN-WEI |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|