发明名称 |
SENSOR DEVICE WITH STEPPED PADS FOR CONNECTIVITY |
摘要 |
A sensor device includes at least one sensor device coupled to a substrate. A solder pad interface includes a plurality of steps, with at least a portion of the steps positioned at different planes, each of a step having a solder pad. A cable with a plurality of cable leads, is configured for each of a cable lead to be coupled to a solder pad. |
申请公布号 |
WO2013137993(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
WO2013US25031 |
申请日期 |
2013.02.07 |
申请人 |
MEGGITT (SAN JUAN CAPISTRANO), INC. |
发明人 |
LETTERNEAU, JAMES, L. |
分类号 |
H05K1/00;H05K1/11;H05K3/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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