发明名称 DMD MODULE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a DMD module cooling device which is capable of quickly absorbing and moving heat generated by a DMD module by use of a heat pipe and a heat block which are coupled with the DMD module, and is capable of preventing damage and malfunction of the DMD module caused by heat.SOLUTION: An embodiment comprises: a heat pipe vertically attached above a DMD module; plate-like heat sinks attached with intervals downward from the upper end of the heat pipe; and a heat block attached under the heat pipe and above the DMD module.
申请公布号 JP2013186474(A) 申请公布日期 2013.09.19
申请号 JP20130041234 申请日期 2013.03.01
申请人 PHILLOPTICS CO LTD;SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 HAN KI SU;PARK JAE HYUN;LI GONG;KIM KWAN SEOK;CHE KWAN MYUNG
分类号 G02B26/02;F28D15/02;G03B21/00;G03B21/16 主分类号 G02B26/02
代理机构 代理人
主权项
地址