发明名称 |
DMD MODULE COOLING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a DMD module cooling device which is capable of quickly absorbing and moving heat generated by a DMD module by use of a heat pipe and a heat block which are coupled with the DMD module, and is capable of preventing damage and malfunction of the DMD module caused by heat.SOLUTION: An embodiment comprises: a heat pipe vertically attached above a DMD module; plate-like heat sinks attached with intervals downward from the upper end of the heat pipe; and a heat block attached under the heat pipe and above the DMD module. |
申请公布号 |
JP2013186474(A) |
申请公布日期 |
2013.09.19 |
申请号 |
JP20130041234 |
申请日期 |
2013.03.01 |
申请人 |
PHILLOPTICS CO LTD;SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
HAN KI SU;PARK JAE HYUN;LI GONG;KIM KWAN SEOK;CHE KWAN MYUNG |
分类号 |
G02B26/02;F28D15/02;G03B21/00;G03B21/16 |
主分类号 |
G02B26/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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