PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL COMPONENT

摘要

The purpose of the present invention is to provide a photosensitive resin composition capable of being coated upon an adherend surface and of being quickly cured by light irradiation, to form a cured product having excellent light-shielding properties and adhesiveness (and, ideally, also having excellent reflow heat resistance). This photosensitive resin composition includes a component (A), a component (C), and a component (D). This photosensitive resin composition ideally also includes a component (B). Component (A): a cationically polymerizable compound including at least a compound having an alicyclic epoxy group and not having an ester bond. Component (B): a hydroxyl group-containing compound having a molecular weight of at least 500. Component (C): a photocationic polymerization initiator. Component (D): a light-shielding material.