| 摘要 |
Provided is method for fabricating a mounting substrate for electronic components which involves the following: a two-sided substrate (11) upon which electronic components (31) are mounted is formed with a first and second one-sided substrate (12a, 12b) which have metal foil (13) attached to one side thereof and between which is disposed an adhesive layer (14) that can be melted by the application of pressure and heat; holes (15) that penetrate from the first one-sided substrate (12a) to the second one-sided substrate (12b) are formed; and a metal plate (3) is mounted on top of the first one-sided substrate (12a), the metal plate (3) is punched through and punched metal material (16) is inserted into the holes (15), and with the punched metal material (16) inserted into the holes (15), the punched metal material (16) is press processed by the application of pressure and heat from at least one side of the two-sided substrate (11). |
