发明名称 |
ELECTRONIC CIRCUIT AND HEAT SINK |
摘要 |
An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 10 10 Ohm×cm or more and a porosity of 15-50 vol%. |
申请公布号 |
EP2639827(A1) |
申请公布日期 |
2013.09.18 |
申请号 |
EP20110840114 |
申请日期 |
2011.11.11 |
申请人 |
KITAGAWA INDUSTRIES CO., LTD.;TYK CORPORATION |
发明人 |
KAWAGUCHI, YASUHIRO;KUBO, MASATAKA |
分类号 |
H01L23/36;H01L23/373;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|