发明名称 ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY
摘要 The invention relates to an adhesive compound containing I. a silane-modified polymer produced by reacting a. a polymer which contains acid anhydride groups with b. a silane having the following formula where R1, R2, R3 are selected independently of each other from the group consisting of methyl, ethyl, 2-methoxyethyl, i-propyl, butyl, m = 0 or 1, n = 0 to 12, p = 1 or 2, and for p = 1, Y = a functional group selected from the group consisting of glycidyl, glycidyloxy, isocyanato, -NH-CH2-CH2-NR4R5, -NR4R5 (with R4 and R5 being selected independently of each other from the group consisting of H, alkyl, phenyl, benzyl, cyclopentyl, cyclohexyl), SH, or for p = 2, Y = NH, II. and containing a cross-linking agent.
申请公布号 EP2638118(A1) 申请公布日期 2013.09.18
申请号 EP20110779146 申请日期 2011.10.27
申请人 TESA SE 发明人 KRAWINKEL, THORSTEN;KEITE-TELGENBUESCHER, KLAUS;GRUENAUER, JUDITH;ELLINGER, JAN;STEEN, ALEXANDER
分类号 C09J7/00;C09J7/02;C09J135/00;C09J153/02 主分类号 C09J7/00
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