| 摘要 |
PROBLEM TO BE SOLVED: To suppress a change in XY-coordinate position of a needle point caused by thermal deformation of a support and a probe substrate to the extent possible. SOLUTION: A method of manufacturing a probe card includes the steps of: heating or cooling a card assembly not including a contact to a set temperature; determining a thermal deformation ratio of the probe substrate under the temperature condition; determining a position of mounting the contact on the probe substrate based on the determined thermal deformation ratio; putting the contact on a lower surface of the probe substrate based on the determined mounting position; and obtaining the probe card. The method includes steps of: thereafter heating or cooling the probe card to the set temperature; measuring a needle point position of the contact when the probe card is put under the set temperature; determining whether the measured needle point position is within a reference range; and determining a temperature for using the probe card in testing an object to be tested. COPYRIGHT: (C)2011,JPO&INPIT
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