| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plating apparatus that keeps height as desired in each pump produced by electroless plating, fixes the height, and improves adhesion with an electrode pad. <P>SOLUTION: The plating apparatus 60 includes a variable-angle chuck 9 which keeps a wafer carrier 11 in an inclined position so that a circuit forming surface 20 of a semiconductor wafer 1 faces upward than a horizontal direction and a transferring arm 10 to perform flotation, sinking, and transfer of the wafer carrier 11 held by the variable-angle chuck 9. The inclined angle θ of the wafer carrier 11 by the variable-angle chuck 9 is ≥20° and ≤40°. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
