| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide component mounting device and method suitable for manufacturing of an electronic component by increasing the number of drive voltage supply lines without increasing the dimensions of an LCD substrate and an FPC board. <P>SOLUTION: The component mounting device mounts an FPC board 12 on an LCD substrate 11. The LCD substrate 11 has a first electrode 11b provided at one side edge part, and a second electrode 11c provided at another side edge facing the side edge part. The FPC board 12 has a first attachment part 12b provided at one side edge part, and a second attachment part 12c provided at the other side edge facing the side edge part. A first mounting machine 31 mounts the first attachment part 12b of the FPC board 12 on the first electrode 11b of the LCD substrate 11. A second mounting machine 32 mounts the second attachment part 12c of the FPC board 12 on the second electrode 11c of the LCD substrate 11. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
