HIGH DENSITY ACTIVE MODULAR OPTOELECTRONIC DEVICE FOR USE WITH PUSH-RELEASE MECHANISM AND METHOD FOR USING SAME

摘要

Super miniature TFF and TFP active modular optoelectronic components are based on an optical interface that is three times less than the size of SFF/SFP components and about six times smaller than an SC based component and thus provides a density that is three times higher than LC interfaces. The invention provides substantially smaller photonic devices that can be used with substantially smaller optoelectronic components and combines the new optoelectronic components with the new smaller miniature interconnect systems such as the Push-Release type using the same interface. The new interface can be used with sub-millimeter or larger diameter ferrules. Photonic devices are mounted in a close proximity of the active end of a fiber stub thereby avoiding the need for lenses and active alignment and enabling use in active hermetic or non-hermetic subassemblies.