发明名称
摘要 PROBLEM TO BE SOLVED: To reduce a loss in a high-frequency circuit superimposed with a direct current, and in a high-frequency circuit or the like superimposed with a low-frequency. SOLUTION: A plurality of insulation covered copper wires (10) plated with magnetic material are collected while twisted in a plurality of numbers or while untwisted. Since the entire surface is arranged with the insulation covered copper wires (10) plated with the magnetic material, resistance under the direct current or the low frequency can be reduced. Since the magnetic field generated by a flowing current is intercepted by the magnetic material plating layer of the insulation covered copper wires (10) plated with the magnetic material, and made difficult to enter the copper wire portion, an increase in copper loss due to proximity effect in the high-frequency can be suppressed, and accordingly, the loss in the high-frequency circuit superimposed with the direct current and the high-frequency circuit or the like superimposed with the low-frequency can be reduced. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5294695(B2) 申请公布日期 2013.09.18
申请号 JP20080125353 申请日期 2008.05.13
申请人 发明人
分类号 H01B7/30;H01F5/00 主分类号 H01B7/30
代理机构 代理人
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