Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape

摘要

The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame. In a preferred embodiment the pressure-sensitive adhesive layer at a side on which a semiconductor chip is not to be encapsulated with a resin comprises a heat-expandable pressure-sensitive adhesive containing heat-expandable micro spheres. In another preferred embodiment the ratio of a silicone rubber to a silicone resin in the silicone pressure-sensitive adhesive is from 95/5 to 20/80.