发明名称 |
ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY |
摘要 |
The invention relates to the use of an adhesive compound for encapsulating an (opto-)electronic application, containing an organometallically modified polymer created by reacting an elastomer with an organometallic compound, wherein the central atom of the organometallic compound is a metal or metalloid of the 3rd and 4th main groups or 3rd and 4th subgroups. |
申请公布号 |
EP2638570(A1) |
申请公布日期 |
2013.09.18 |
申请号 |
EP20110779147 |
申请日期 |
2011.10.27 |
申请人 |
TESA SE |
发明人 |
STEEN, ALEXANDER;KRAWINKEL, THORSTEN;KEITE-TELGENBUESCHER, KLAUS;GRUENAUER, JUDITH;ELLINGER, JAN |
分类号 |
H01L23/29;C09J109/06;C09J153/00 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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