| 发明名称 |
Circuit board, structural unit thereof and manufacturing method thereof |
| 摘要 |
<p>A circuit board, structural units and a manufacturing method are provided, wherein one or more high temperature lamination processes are conducted for laminating the structural units and form a multi-layered circuit board.</p> |
| 申请公布号 |
EP2639821(A2) |
申请公布日期 |
2013.09.18 |
| 申请号 |
EP20130000784 |
申请日期 |
2013.02.15 |
| 申请人 |
HTC CORPORATION |
发明人 |
HO, CHIN-WEI;TSAI, HUI-LING |
| 分类号 |
H01L21/48;H05K1/03;H05K3/46 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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