| 摘要 |
<p>A multilayered wiring substrate (1) that includes at least one signal layer (3) and at least one ground layer (2) is provided. The multilayered wiring substrate includes a first signal via (12A) that extends in a direction substantially perpendicular to the layers of the multilayered wiring substrate, is conductively connected to one of a pair of differential signaling wires (30A) provided in the signal layer, and is formed on a first grid point; and a second signal via (12B) that extends in a direction substantially perpendicular to the layers of the multilayered wiring substrate, is conductively connected to the other of the pair of differential signaling wires (30A), and is formed on a second grid point that is positioned diagonally adjacent with respect to the first signal via.</p> |
